|
General Information |
| |
| |
Authors |
|
| |
Conference Highlights |
|
| |
Attendees |
| |
| |
Links |
| |
|
2007 IEEE RFIC Symposium
panel session information |
Monday
12:00-13:15 PMA HCC - 313C |
|
RFID: New Revolution or Remarketing of Existing Technologies in a New Package?
Moderator: Sayfe Kiaei, Arizona State University
Panelists: Reza Rofougaran, Broadcom Inc.; Ganesh K. Balachandran, Texas Instruments; Mitsuo Usami, Hitachi, Ltd.; Frank Mau-Chung Chang, UCLA; Robert Plana, LAASCNRS; Issy. Kipnis, Intel; Scott Chiu, Intel; John Adams, Freescale Inc.
Sponsor: RFIC
This panel will focus on the development, architecture, applications, security, and system-level issues of RFIDs. New RFID technologies have the potential to revolutionize business processes and help create innovative end-user applications.This panel will discuss the future of RFID technologies and the potential impacts of this technology:
- What is unique and new in RFID?
- What is different from ZIGBEE and other 802.11 low-power solutions?
- Will it take the Bluetooth path?
- Is it a marketing hype or a reality?
- What are the RF-design challenges here?
|
TUESDAY
12:00-13:15 PTUA HCC - 313C |
|
CMOS Millimeter-Wave MMIC: Real or Bubble?
Moderator: Hiroshi Kondoh, Hitachi Ltd.
Panelists: Sorin Voinigescu, University of Toronto; Rudolf Lachner, Infineon Technology; Huei Wang, National Taiwan University; Kenjiro Nishikawa, NTT; Tuneo Tokumitsu, Eudyna Devices; Herbert Zirath, Chalmers Univ. of Technology; AliM. Niknejad, UC Berkeley
Sponsor: RFIC
CMOS would be the most promising device for millimeter applications. But, when will the millimeter-wave CMOS IC be a real product? What kinds of applications are expected? The panel will discuss the pros and cons of CMOS and other devices, and will show these technical tends/market forecast. |
TUESDAY
12:00-13:15 PTUB HCC - 316C |
|
Your GaAs Foundry and the Future: Anyone Have Issues? Of Course!
Moderators:
- Brad Nelson, Sirenza Microdevices
- Paul Blount, Custom MMIC Design Services
Panelists: Wing Yau, Global Communication Semiconductor; Bob Donahue, Win Semiconductor; Phillipe Labasse, United Monolithic Semiconductors; Mike Peters, TriQuint Semiconductor; Marc Rocchi, Ommic; David Smith, Filtronic
Sponsor: IMS
Come ask the foundries how they plan to solve your problems. This panel session will address key issues facing GaAs foundries and their customers today and in the future: performance, reducing cost, quality control, emerging markets, second sourcing, consolidation, disruptive technologies. |
WEDNESDAY’S PANELS
12:00-13:15 PWA HCC - 313C |
Is GaN Ready for Prime Time?
Moderator: Mark Rosker, DARPA |
12:00-13:15 PWB HCC - 316C |
Will RF-MEMS Make the Commercial Leap?
Moderators:
- Scott Barker, University of Virginia
- Gabriel Rebeiz, University of California San Diego
|
12:00-13:15 PWC HCC - 317A |
Grant Opportunities at the National Science Foundation
Moderators:
- Leda Lunaradi, NSF
- Don Senich, NSF
|
THURSDAY’S PANELS
10:10 - 11:50 PTHA HCC - 317A |
|
Career Development: Giving Your Career A Never-Ending Boost
Moderators:
- S. Pacheco, Freescale Semiconductor
- R. Henderson, Freescale Semiconductor
|
12:00 - 13:15 PTHB HCC - 313C |
THz Electronics for the 21st Century
Moderator: Richard Lai, NGST |
12:00–13:15 PTHC HCC - 316C |
RF Techniques for Signal Integrity Engineering
Moderator: Ashok Bindra, RF Design Editor |
|
Home |
About Us |
Contact Us
(c)Copyright 2005-2007 IEEE 2007 RFIC Symposium. All rights reserved.
|
|
|
|
| Important Dates |
| Workshop Proposal Due
15 Sept, 2006
Paper Submission Due
10 Jan, 2007
Program book, conference and hotel registration open
Early March, 2007
Final Manuscript Due
5 March, 2007
RFIC 2007
3-5 June, 2007
|
|
 |